1 E-mail:http://www.LGEservice.com/techsup.html COLOR MONITOR SERVICE MANUAL MODEL:L192WS-BNQ/SNQ. A**JQP/ A**QQP ( ) **Same model for Service CAUTION BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. *To apply the MSTAR Chip. 2 MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR POWER ON (TYPICAL) ON/ON ACTIVE 34 W TYPICAL GREEN OFF/ON ON/OFF OFF/OFF POWER S/W OFF - - Less than 1 W OFF OFF Less than 1 W AMBER SLEEP MODE CONTENTS SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 DISASSEMBLY ........................................................ 8 BLOCK DIAGRAM...................................................10 DISCRIPTION OF BLOCK DIAGRAM ................... 11 ADJUSTMENT ...................................................... 13 SERVICE OSD .........................................................14 TROUBLESHOOTING GUIDE ............................. 15 WIRING DIAGRAM ............................................... 22 EXPLODED VIEW ................................................... 23 REPLACEMENT PARTS LIST .............................. 25 SCHEMATIC DIAGRAM ...........................................34 SPECIFICATIONS 1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area : 19 inch Pixel Pitch : 0.285 (H) x 0.285 (V) Color Depth : 16.2M colors 5. POWER SUPPLY 5-1. Power: AC 90~264V, 50~60Hz , <0.8A 5-2. Power Consumption Size : 427.2 (H) x 277.4 (V) x 17 (D) Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Haze=25% Anti-Glare treatment Operating Mode : Normally White, Transmissive mode Backlight Unit : Top/Bottom edge side 4-CCFL (Cold Cathode Fluorescent Lamp) 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio ≥ 10 (a) For InnoLux MT190AW01-V2 panel: Left 80°/Right 80°;Top 80° /Bottom 80° at type CR≥10 (b) For CMO M190A1-L02 panel: Left 85°/Right 85°;Top 80°/Bottom 80° at type CR≥10 2-2. Luminance (a) For InnoLux MT190AW01-V2 panel: 300cd/m2 (Typ.) 220cd/m2 (Min.) (6500k); 170 cd/m2 (Min.)(9300k) (b) For CMO M190A1-L02 panel: 300cd/m2 (Typ.) 220cd/m2 (Min.) (6500k);170 cd/m2 (Min.)(9300k) 2-3. Contrast Ratio (a) For InnoLux MT190AW01-V2 panel: 500:1 minimum; 700:1 Typical (b) For CMO M190A1-L02 panel: 500:1 minimum; 850:1 Typical 3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal Type : Separate Sync, Composite, SOG (Sync On Green) 3-2. Video Input Signal 1) Type : R, G, B Analog 2) Voltage Level : 0~0.71 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.467 Vp-p c) Color 15, 0 : 0.714 Vp-p 3) Input Impedance : 75 Ω 3-3. Operating Frequency Horizontal : 30 ~ 83kHz Vertical : 50 ~ 77Hz 4. Max. Resolution D-sub Analog : 1440 x 900@75Hz 6. ENVIRONMENT 6-1. Operating Temperature : 0°C~40°C (Ambient) 6-2. Relative Humidity : 20%~90% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90% Confidence Lamp Life : 50,000 Hours(Min) 7. DIMENSIONS (with TILT/SWIVEL) Width : 434.8 mm Depth : 180 mm Height : 370 mm 8. WEIGHT (with TILT/SWIVEL) Net. Weight : 4.2±0.4 kg Gross Weight : 5.2±0.4 kg 3 CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation. PRECAUTION WARNING FOR THE SAFETY-RELATED COMPONENT. • There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard. • Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee. TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. • Must mount the module using mounting holes arranged in four corners. • Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. WARNING BE CAREFUL ELECTRIC SHOCK ! • If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. • Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire. • Be careful while tilting and rotating the monitor to avoid pinching hand(s) Leakage Current Hot Check Circuit AC Volt-meter Good Earth Ground such as WATER PIPE, • Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. • Protect the module from the ESD as it may damage the electronic circuit (C-MOS). • Make certain that treatment person’s body are grounded through wrist band. • Do not leave the module in high temperature and in areas of high humidity for a long time. • The module not be exposed to the direct sunlight. • Avoid contact with water as it may a short circuit within the module. • If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.) To Instrument's exposed METALLIC PARTS 1.5 Kohm/10W CONDUIT etc. 4 SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton- tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti- static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) 5 General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。 F to 600。 F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500。 F to 600。 F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500。 F to 600。 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. 6 Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. 7 TIMING CHART VIDEO A E D B SYNC C M distingishme nt Polority DOT CLOCK [MHz] Frequency [kHz]/ [Hz] Total period (E) Display (A) Front Porch (D) Sync. (C) Back Porch (B) Resolution H(Pixels) + 31.469 800 640 16 96 48 1 V(Lines) - 25.175 70.8 449 350 37 2 60 640 x 350 H(Pixels) - 31.468 900 720 18 108 54 2 V(Lines) + 28.321 70.09 449 400 12 2 35 720 X 400 H(Pixels) - 31.469 800 640 16 96 48 3 V(Lines) - 25.175 59.94 525 480 10 2 33 640 x 480 H(Pixels) - 37.5 840 640 16 64 120 4 V(Lines) - 31.5 75 500 480 1 3 16 640 x 480 H(Pixels) + 37.879 1056 800 40 128 88 5 V(Lines) + 40.0 60.317 628 600 1 4 23 800 x 600 H(Pixels) + 46.875 1056 800 16 80 160 6 V(Lines) + 49.5 75.0 625 600 1 3 21 800 x 600 H(Pixels) +/- 49.725 1152 832 32 64 224 7 V(Lines) +/- 57.283 74.55 667 624 1 3 39 832 x 624 H(Pixels) - 48.363 1344 1024 24 136 160 8 V(Lines) - 65.0 60.0 806 768 3 6 29 1024 x 768 H(Pixels) - 60.123 1312 1024 16 96 176 9 V(Lines) - 78.75 75.029 800 768 1 3 28 1024 x 768 H(Pixels) +/- 68.681 1456 1152 32 128 144 10 V(Lines) +/- 100.0 75.062 915 870 3 3 39 1152 x 870 H(Pixels) +/- 61.805 1504 1152 18 134 200 11 V(Lines) +/- 92.978 65.96 937 900 2 4 31 1152 x 900 H(Pixels) + 63.981 1688 1280 48 112 248 12 V(Lines) + 108.0 60.02 1066 1024 1 3 38 1280 x 1024 H(Pixels) + 79.976 1688 1280 16 144 248 13 V(Lines) + 135.0 75.035 1066 1024 1 3 38 1280 x 1024 H(Pixels) + 55.5 1600 1440 48 32 80 14 V(Lines) - 88.750 59.90 926 900 3 6 17 1440 x 900 H(Pixels) - 55.935 1904 1440 80 152 232 15 V(Lines) + 106.500 59.887 934 900 3 6 25 1440x 900 H(Pixels) - 70.635 1936 1440 96 152 248 16 V(Lines) + 136.750 74.984 942 900 3 6 33 1440x 900 8 DISASSEMBLY #1 #2 #3 #4 #6 #5 Put a soft cushion on the desk and lay the stand on its side so that the base is accessible. Unscrew the 4 screws on the hinge to separate the hinge neck ass’y . Twist the stand assy until “click” , then take out the stand assy into the product in the correct direction as shown in picture. Pry the hinge cover by flat-tip screw driver or jig and be careful to prevent from scratching the hinge cover. Pull up the front cover side by side(4 sides) and take away the front cover Turn over the set and pull up the cabinet to separate the control cable, then take away the back cover 9 #8 #7 Pull out the LVDS cable Pull out the lamp wire. 10 InnoLux TFT-LCD Module with 4FFCLs AC Input AC Socket TSUM16AL-LF-1 LVDS Transmitter MCU ADC D-sub Analog RGB Signal 3.3V and 1.8V regulator EEPROM 24C04 OSD parameters Timing parameters Key pad 24C02 DDC 128KB Flash ROM 14V 5V Inverter Power AC to DC (14V&5V) BLOCK DIAGRAM L192WS consists of a main body and a stand (base). The main body contains a InnoLux (or CMO) LCD module with 4 CCFL lamps, a power board (includes AC/DC, DC/DC, inverter and panel power source), a control board (key pad) and an interface board. The block diagram is shown as below. 11 DESCRIPTION OF BLOCK DIAGRAM 1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC convertor and LVDS transmitter. The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 14V is provided for inverter, 14V is provided for LCD panel and 5V for micom. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. The inverter converts from DC14V to AC 700Vrms and operates back-light lamps of module. 3. MICOM Part. This part is include video controller part. And this part consists of EEPROM IC which stores control data, and the Micom which imbedded in scaler IC. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM. 12 LIPS Board Block Diagram Operation description_LIPS 1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage. 6. Signal collection. This part function is to collect the any change from the dc output and feed back to the primary through photo transistor. 50~60Hz 13 ADJUSTMENT Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy “UserPort.sys” file to “c:\WINNT\system32\drivers” folder b) Run Userport.exe c) Remove all default number d) Add 300-3FF e) Click Start button. f) Click Exit button. 2. EDID Read & Write 1) Run WinEDID.exe 2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button 14 SERVICE OSD 1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C04) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : Show Current module Type j)RS232: Enable/Disable Debug Mode(on/off) Insert to Parallel Port on PC ISP Board LCD Monitor D- Sub Parallel Port D-SUB 15PIN Figure 1.Cable Connection For ISP 15 TROUBLESHOOTING GUIDE 1. No Power & Power LED Off No power Check primary rectifier voltage Check IC802, C805, T801 Check circuit if short Check F801, P801, D801 Check pin3 of IC802 voltage about 1V Check R801, R805, R822, R823, R817 Check pin2 of IC802 voltage about 2V Check R803, R807, R824, R825 Check pin1 of IC802 voltage is 5.8V Check R812, R816, C818 END 16 2. Backlight can’t be turned on No raster? LED Green? Yes Yes Yes Backlight can’t be turned on. No Check power supply Is there high-level voltage on pin10 of IC501? No Is Ok R526? Check I/F board Yes R526 open No Yes Is there instantaneously pulse wave on pin1, pin3, pin15 of IC501 at the moment of restart? No Is Ok IC501? Yes U501, U502 fail No IC501 fail Yes Is ok T501, T502? T501, T502 fail Are connected rightly CN501, CN502, CN503 and CN504? No Connecting the output connector again No Check feedback circuit Isen,Vsen.(D501,D502.D503,D504,D507,D508) Yes END Is there 5Vdc voltage on pin2 of IC501? Yes Yes 17 3. DC output voltage is unstable Check R810, R811 Check feedback circuit Check Vpin3-4 of IC801 about 6V Check Vpin1-2 of IC801 about 1V Check C815, D806, R812 Check R809, R814 END 1. Output Voltage Unstable Check Vbe of Q801 below 0.3V Check circuit if short Check ZD801, ZD802, ZD803, D803, D805 Check Q801, Q802 Check reference voltage Check Pin R of IC803 voltage about 2.5V Check R809, R814, IC801, R818 18 4.Output power is unstable Check the R pin voltage of IC803 about 2.5V Check R809, R808, R814, D809 Check D806, C815 if short Change D806, C815 Check pin1 of IC802 voltage is 5.8V Check pin3 of IC802 voltage about 1V Change R801, R805, R822, R823, R817 END Check the C pin voltage of IC803 if 3V Change IC803 Unstable power Check sampling Circuit Check R810, R811, R818 Change R810, R811, R818 19 5.Black Screen and backlight turn on Black Screen Power Fail Check power supply: Pin1, 2 of CN101 Check pin34, 51, 66, and 82 Of U105 Check Crystal: Pin96, Pin97 Of U105 Check CCFL - Enable (pin85) of U105 MCU (imbedded in Scaler IC) Fail Check FB103 Check: X101, C153, C154 Inverter Fail OK NG NG OK OK NG Check Reset (pin84) Of U105 Check pin5 of CN101 Check R167, Q106 R108, R110 Check C144, R172 OK NG NG NG OK OK Check pin32, 49, 56, and 75 Of U105 NG OK And U102 Check FB106 And U101 20 6.White Screen White Screen LVDS Cable Reinsert Change LVDS Cable Check VLCD Is 5V? Check Panel - Enable Of U105 (pin48) is High? Check R168, R105 Q103, Q101 END Workmanship LVDS Cable NG Panel Fail Check LVDS Signals Check the HW Reset Of U105 pin84 Check the pins Of U105 Check C144 ,R172 NG NG NG NG NG NG OK OK OK OK OK OK 21 7. BAD SCREEN Bad Screen Workmanship LVDS Cable Reinsert Change LVDS Cable Check Crystal:Pin96,97 Of U105 Check the communication Of U105 and U106 Check the pins of U105 and U106 LVDS Cable NG Check :X101, C153,C154 Check: SDO,SCZ, SCK,SDI, Reset NG OK OK NG OK OK OK NG 22 WIRING DIAGRAM - 23 - EXPLODED VIEW 050 150 140 010 020 030 040 170 060 070 080 090 160 100 110 120 130 EXPLODED VIEW PARTS LIST Ref.No. LGE Part No. INL Part No. Description 501010209600R BEZEL,FRONT(S),LE1957 10 501010209610R BEZEL,FRONT(B),LE1957 20 ABJ32903501 501120105100R LENS(T),LE1957 EBU36594401 631102090821R LCP 19" MT190AW01-V2- G1,AM1900004201(INL) EBU36577201 631102090650R LCD PANEL 19"M190A1-L02(A)(CMO)ROHS COV30007501 631102091401R LCP 19" MT190AW01-V5- G1,AM1900004511(IN 631102091080R LCP 19" LM190WX1-TLC1(A)(LPL)RoHS 30 COV30007601 631102091370R LCP 19" M190MWW1-201(A)(MTDIS)ROHS 40 EBU36576401 790841400600R PCBA,P/I BOARD,LE1957-610 ROHS EBU36589602 790841300600R PCBA,I/F BOARD(V2),LE1957-610 ROHS 790841300500R PCBA,I/F BOARD,LE1957-510 ROHS 790841300601R Main board L192WS LPL INNOLUX DISPLAY CO. 790841300A02R 50 790841300E00R 60 ADV32904101 701000003000R ASSY,CHASSIS,LE1957 70 EBU36589701 790841500000R PCBA,KEYPAD BOARD,LE1957 ROHS 80 MEY37547401 501030205700R BUTTON,FUNCTION KEY(B),LE1957,ROHS 90 MEY37547601 501030205710R BUTTON,POWER KEY(B), LE1957 ROHS 100 ACQ32904401 714020008900R ASSY,BASE(B),LE1957 110 ACQ32904601 714010009300R ASSY,STAND(B),LE1957 120 ACQ32904701 714010009310R ASSY,STAND NECK,LE1957 130 MCK37548201 501020212000R COVER,HINGE(B),LE1957,ROHS 140 MCK37548401 714050009000R COVER,BACK(B),LE1957,ROHS 150 EBU36589801 430303000730R HRN LVDS FFC 30P 155mm ACCP30155MU28MY 6410TUW008A 453070800150R PWR CORD 10A/125V BLK 6FT UL/CSA,SVT 3Cx ---US/Mexico/Panama/Canada 6410TBW004A 453070800720R PWRCORD 10A/250V BLK 6FT UK,H05VV-F 3Cx0 ---UK/Malaysia/Singapore 6410TEW003A 453070800730R PWRCORD 16A/250V BLK 6FT VDE,H05VV-F 3Cx ---Europe/Thailand/Vietnam/Russia/U.A.E 6410TSW003A 453070800740R PWRCORD 10A/250V BLK 1850mm SAA,H05W-F 3 ---Australia 160 6410TTW001A 453070800750R PWRCORD 7A/125V BLK 1850mm CNS,VCTF 3Gx0 ---Taiwan 170 EBU36590701 430300800830R HRN ASS'Y 2*4p to 1*8p 305mm UL1571#28 ABJ32903502 MKC37547001 EBU59474601 COV30013906 EBU59474701 EBU59475101 Main board L192WS LPL INNOLUX DISPLAY CO. Main board L192WS LPL INNOLUX DISPLAY CO. 25 REPLACEMENT PARTS LIST CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL. * NOTE : S SAFETY Mark AL ALTERNATIVE PARTS Power and Inverter PCBA Board Item Location P/N Description 790841400600R PCBA,P/I BOARD,LE1957-610 ROHS 10 IC801, 412140002380R IC LTV817M-PR VDE (LITE-ON) P=10mm RoHS 10 RA 412140001390R IC EL817M-B(EVERLIGHT)RoHS 20 U501,U502, 410500071290R XSTR AP9971GD,N-CH,PDIP-8(APEC RoHS 20 RA 410500061271R XSTR AOP802 DUAL N-CH PDIP-8(AOS)RoHS 30 D801, 411050005020R DIO BRDG BL4-06-BF52-LF 600V/4A(FRONTIER 30 RA 411050007010R DIO BRDG KBL405G 600V/4A(TSC) RoHS 30 RA 411050005090R DIO BRDG FL406 600V/4A(PEC)RoH S 40 C804, 416194743011R CAP MEX 0.47uF 275V K X2,F15 RoHS 50 C820,C801,C806, 416202224610R CAP MEY 2200pF 400V M Y,F10mm RoHS 60 C812,C809, 420421020102R CAP EC 1000uF/10V M,105℃ N-F 10x16(L-ES 70 C808, 420421020211R CAP SD 1000uF 25V M,105℃ F 13x20 RoHS 80 C805, 420431214580R CAP SEK 120uF 450V 18*40 M CF 105℃ 90 C824, 416204724610R CAP MEY 4700pF 400V M Y,F10mm RoHS 100 L802,L803, 425000010530R COIL CHK 5uH 7.8X10 CHK-053 0 181085R0L 110 L801, 426000050070R CHOKE L-FILTER 12mH LIN-007 ET-20,RoHS 120 T801, 426000090510R XFMR 750u@1K,+-8%,3m,113m,SPW- 051,DIP-1 130 RT801, 432009401300R NTC 8Ω 4A 13Φ P＝7.5mm F ROHS 140 F801, 430613430290R FUSE SLOW 3.15,250,Axial Lead,3.6 x10mm 150 P801, 440149000220R SKT AC 10A/250V U/C/V,G/Y=45mm TU-301-SP 160 CN501,CN502,CN503,CN504, 430637020030R WFR. 2P P=3.5mm 90°W/LOCK,RoHS 170 CN801, 430300600170R HRN ASS'Y 6P 90mm UL1007#24, ROHS 180 C525,C527, 418105058010R CAP CD SL 5pF 3KV K,F7.5 RoHS 190 C803, 418247233020R CAP CD X7R 4700pF 1KV K,W/O FO RMING,RoH 200 C524,C526, 418110058510R CAP CD SL 10pF 3KV J,F7.5 RoHS CC45SL3FD 210 T501,T502, 426000090680R XFMR SW,121.5uH EEL19M DIP SPW-068,RoHS 220 H501, 502040604500R SHIELD,EMI, LE1915 ROHS 230 735100007120R ASSY,H/S,SBR10U100CT/U40CT, LE1710 240 735100005900R ASSY,H/S TOP246Y, LE1X09 ROHS 250 790841440600R PCBA,P/I BOARD,SMD,LE1957-610 ROHS 260 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 26 260 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 270 511110000101R HOT-MELT ADHESIVES (#526) 280 511110000501R SILICONE RTV RUBBER,UB-511(EURO) Item Location P/N Description 735100005900R ASSY,H/S TOP246Y, LE1X09 ROHS 10 IC802, 412000379270R IC TOP246YN,TO-220-7C(POWER IN TEGRATION 20 507200003700R HEATSINK,46x20xt10mm LE1704/05 30 509112306100R SCREW,P,CROSS,T.T-3*6,ZnROHS Item Location P/N Description 735100007120R ASSY,H/S,SBR10U100CT/U40CT, LE1710 10 D803, 411090009480R SCHTKY SP10100C 100V/10A ITO220(WILLAS)R 10 RA 411090041010R SCHTKY SRF10100 100V/10A ITO220AB(TSC)Ro 20 D805, 411090024480R SCHTKY SP1040C 40V/10A ITO220(WILLAS)RoH 20 RA 411090040010R SCHTKY SRF1050 50V/10A ITO220AB(TSC)RoHS 20 RA 411090024010R SCHTKY SRF1040 40V/10A ITO220AB(TSC)RoHS 30 507200003800R HEATSINK,56x20xt10mm LE1904/05 40 509112306100R SCREW,P,CROSS,T.T-3*6,ZnROHS Item Location P/N Description 790841440600R PCBA,P/I BOARD,SMD,LE1957-610 ROHS 10 Q801, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 10 RA 410500045140R XSTR MMBT3904LT1G NPN 200MA 40V SOT23(ON 10 RA 410500045090R XSTR MMBT3904 NPN SOT-23(PANJIT)RoHS 20 IC501, 412000455630R IC OZ9938GN SOIC16(O2 MICRO)RoHS 30 D501,D502,D503,D504,D507,D508, 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 30 RA 411020026390R DIO BAV99,SOT-23(INFINEON)RoHS 30 RA 411020026020R DIO BAV99-LF 350mW 70V SOT-23 (FEC)RoHS 30 RA 411020026090R DIO BAV99 350mW 75V SOT-23(PEC RoHS 40 D505,D506, 411020068020R DIO BAW56 70V SOT-23(FRONTIER)RoHS 40 RA 411020068090R DIO BAW56 75V SOT-23(PANJIT)RoHS 40 RA 411020068210R DIO BAW56 85V SOT-23(PHILIPS)RoHS 50 ZD803, 411100956920R ZENER 5.6V MMSZ5232A SOD123(PE C)RoHS 50 RA 411131556920R ZENER 5.6V 0.5W DDZ5V6B-F,SOD1 23(DIODES 50 RA 411131456920R ZENER 5.6V MMSZ5232A SOD-123(WILLAS)ROHS 60 ZD801, 411100991950R ZENER 9.1V MMSZ5239B SOD123(PE C)RoHS 60 RA 411131591952R ZENER 9.1V 0.5W DDZ9V1C-F,SOD1 23(DIODES 60 RA 411131491920R ZENER 9.1V MMSZ5239A SOD-123(WILLAS)ROHS 70 ZD804, 411100916020R ZENER 16V MMSZ5246A SOD123(PEC RoHS 27 70 RA 411131516052R ZENER 16V 0.5W DDZ16-F,SOD123(DIODES)RoH 70 RA 411131416020R ZENER 16V MMSZ5246A SOD-123(WILLAS)ROHS 80 ZD805, 411100912020R ZENER 12V MMSZ5242A SOD123(PEC RoHS 80 RA 411131512052R ZENER 12V 0.5W DDZ12C-F,SOD123 (DIODES)R 80 RA 411131412020R ZENER 12V MMSZ5242A SOD-123(WILLAS)ROHS 90 R511,R510, 414916033050R RES SMD (0603) 33Ω J,RT RoHS REV:A 100 R802,R806, 414904010050R RES SMD (1206) 10Ω J,RT RoHS 110 R809, 414904100010R RES SMD (1206) 100Ω F,RT RoHS 120 R813,R814,R815, 414908010250R RES SMD (0805) 1KΩ J,RT RoHS REV:A 130 R512,R526, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS 140 R808,R819,R827, 414908010350R RES SMD (0805) 10KΩ J,RT RoHS REV:A 150 R514, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS 160 R513,R529,R530, 414916010550R RES SMD (0603) 1MΩ J,RT RoHS REV:A 170 R817, 414908120210R RES SMD (0805) 12K F RT RoHS REV:A 180 R829, 414908020150R RES SMD (0805) 200Ω J,RT RoHS 190 R534, 414916220110R RES SMD (0603) 2.2KΩ F,RT RoHS 200 R524, 414916220210R RES SMD (0603) 22KΩ F,RT RoHS 210 R506,R508,R532,R533, 414908033050R RES SMD (0805) 33Ω J,RT RoHS 220 R818,R517,R520, 414908330110R RES SMD (0805) 3.3KΩ F,RT RoHS REV:A 230 R523, 414916330210R RES SMD (0603) 33KΩ F,RT RoHS 240 R527, 414916330410R RES SMD (0603) 3.3M F RT RoHS 250 R801,R805,R822,R823, 414908033550R RES SMD(0805) 3.3MΩ J,RT,RoHS 270 R522, 414916453210R RES SMD (0603) 45.3KΩ F RT ROHS 280 R509,R539,R540,R541,R542, 414916470010R RES SMD (0603) 470Ω F,RT RoHS 290 R825, 414908047450R RES SMD (0805) 470KΩ J,RT RoHS 300 R810, 414908510110R RES SMD (0805) 5.1KΩ F,RT RoHS 310 R811, 414908510210R RES SMD (0805) 51KΩ F,RT RoHS 320 R803,R807,R824, 414908051450R RES SMD (0805) 510KΩ J,RT RoHS 330 R538, 414916604310R RES SMD (0603) 604KΩ F,RT RoHS 340 R816, 414908068950R RES SMD (0805) 6.8Ω J RT RoHS 350 R535, 414908075150R RES SMD (0805) 750Ω J,RT RoHS REV:A 360 C504, 419311020060R C SMD(0603) X7R 1000PF/50V K RoHS 370 C501,C502,C513,C514,C535,C536, 419311020070R C SMD(0805) X7R 1000PF/50V K RoHS 380 C505, 419311030060R C SMD(0603) X7R 0.01uF/50V K RoHS 390 C821, 419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS 400 C531, 419301810560R C SMD(0603) NPO 180PF/50V J RoHS REV:A 410 C511,C507, 419342254670R C SMD(0805) Y5V 2.2uF/16V Z RoHS 420 C529, 419302710560R C SMD(0603) NPO 270PF/50V J RoHS REV:A 430 C508,C512,C516, 419313333060R C SMD(0603) X7R 0.033uF/25V K RoHS 450 C506, 419314720060R C SMD(0603) X7R 4700PF/50V K RoHS 28 460 C523,C530, 419316820070R C SMD(0805) X7R 6800PF/50V K RoHS 470 C510,C532, 419316830060R C SMD (0603) X7R 0.068uF 50V,K RoHS 480 790841410600R PCBA,P/I BOARD,AI,LE1957-610 ROHS Item Location P/N Description 790841410600R PCBA,P/I BOARD,AI,LE1957-610 ROHS 10 790841450600R PCBA,P/I BOARD,AI/A,LE1957-610 ROHS 20 790841460600R PCBA,P/I BOARD,AI/R,LE1957-610 ROHS Item Location P/N Description 790841450600R PCBA,P/I BOARD,AI/A,LE1957-610 ROHS 10 R828, 415340101540R RES MOF 1W 100Ω J,AT MINI RoHS 20 R820,R821, 415030105540R RES CF 1/2W 1MΩ J,AT MINI RoHS 30 R503,R501, 414870305540R RES MG HV 1/2Ws 3MΩ 3KV J,AT RoHS 40 R521, 415020330540R RES CF 1/4W 33Ω J,AT MINI RoHS 50 R812, 414020689540R RES FSM 1/4W 6.8Ω J AT MINI,RoHS 60 R804, 415130680540R RES CF 1/2W 68Ω J,AT RoHS REV:A 70 D806, 411020052020R DIO A02-LF 200V/1A R1(FEC)RoHS 70 RA 411030003040R DIO FR103 200V/1A DO-41(MOSPEC RoHS 70 RA 411030065090R DIO PS102R 200V/1A DO-41(PEC)ROHS 80 D809, 411022003210R DIO 1N4148 75V/0.2A AT (PHIL) RoHS 80 RA 411022003020R DIO 1N4148-LF 75V/0.15A AT (FEC)RoHS 80 RA 411020048090R DIO 1N4148-35 75V/0.15A,DO35(P EC)RoHS 90 D804, 411020053090R DIO PS1010R 1000V/1A DO-41(PAN JIT)RoHS 90 RA 411032006020R DIO FR10-10-LF 1000V/1A AT(FRO NTIER)RoH 100 ZD802, 411020050090R DIO P6KE150A,DO-15,AT(PANJIT)RoHS 100 RA 411020050020R DIO P6KE150A-LF AT(FRONTIER) RoHS 100 RA 411020050010R DIO P6KE150A,DO-15AT,(TSC)RoHS 110 F802, 430613040100R FUSE SLOW PICO II 4A/125V U/C,AT,RoHS 120 J502,J503,J510,J511,J514,J804,J805,J809, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 7.5MM 120 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 7.5MM 130 J501,J504,J512,J513,J803,J808, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 10MM 130 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 10MM 140 J506,J509,J810,J812, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 12.5MM 140 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 12.5MM 150 J507,J508, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 15MM 150 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 15MM 160 J802, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 17.5MM 160 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 17.5MM 170 J505, 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 20MM 29 170 RA 430405000000R JMPR ROLL/KG D=0.6mm,AT,RoHS 20MM 180 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB 190 700000000300R ASSY,PCB&RIVENT,LE1957 ROHS Item Location P/N Description 790841460600R PCBA,P/I BOARD,AI/R,LE1957-610 ROHS 10 C802,C811, 418210227030R CAP CD X7R 1000pF 500V K VT RoHS 20 C817,C822, 419111040030R CAP MTL X7R 0.1uF 50V K,VT, RoHS 30 C816, 416231041530R CAP MEB 0.1uF 100V J,(RSB),VT RSBEC3100D 30 RA 416141041531R CAP MKT 0.1uF 100V J,VT(ARCO) RoHS,R82EC 40 C522, 420421510330R CAP SD 150uF 35V M,105℃ VT 8x12 RoHS 50 C509, 420422210360R CAP SD 220uF/35V M 105℃ ST,10x13,RoHS 60 C813, 418147038530R CAP CD NPO 47pF 1KV J,VT RoHS 70 C814,C815,C818,C819, 420264700230R CAP SH 47uF 25V M,125℃,VT, 6.3x11,RoHS 80 C810, 420424710260R CAP SD 470uF/25V M 105℃ ST 10x16,RoHS 90 Q802, 410072013210R XSTR 2PC1815GR*I VT (PHILIPS) RoHS REV: 90 RA 410072013370R XSTR 2SC1815-GR (T2SPF.T) VT (TOSHIBA)Ro 90 RA 410072013150R XSTR UTC2SC1815L-GR NPN TO92 (UTC)RoHS 100 IC803, 412022002840R IC TL431ACLPG TO-92 1%,VT(ON)RoHS 100 RA 412022002240R IC KA431AZ 1%,VT (FAIRCHILD) RoHS 100 RA 412022002300R IC AP431VL TO-92 1% VT (ATC) RoHS 100 RA 412022002830R IC AS431 TO-92 VT(A1SEMI)RoHS Item Location P/N Description 700000000300R ASSY,PCB&RIVENT,LE1957 ROHS 10 490831400100R PCB,P/I BOARD,LE1957 ROHS 20 M3,M4,M5,M6,M7,M8, 512006000500R RIVET,Φ 3.0xΦ 1.6x3.0mm 30 M1,M2, 512006000600R RIVET,Φ 4.1xΦ 2.2x3.0mm Control PCBA Board Item Location P/N Description 790841500000R PCBA,KEYPAD BOARD,LE1957 ROHS 10 LED101, 411070089450R LED Y/G∮3x5mm HTL-7VYVG4B1F-D12-FB-LC4. 20 SW101,SW102,SW103,SW104,SW105, 430602980120R SW TACT 160gf 1P,H=4.3mm,DIP SFKHHAL2420 30 CN101, 430300800840R HRN ASS'Y 8p 65mm UL1571#28 40 490831500100R PCB,KEYPAD BOARD,LE1957 ROHS 50 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 50 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 60 502110400100R SPRING SHEET, LE1730 30 Main PCBA Board For INL Module Item Location P/N Description 790841300600R PCBA,I/F BOARD(V2),LE1957-610 ROHS 10 629030009400R PROGRAM(V2),LE1957-610 ROHS 20 790841320600R PCBA,I/F BOARD,MI,LE1957-610 ROHS 30 790841340600R PCBA,I/F BOARD,SMD,LE1957-610 ROHS 40 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 40 RA 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 50 506440003800R LABEL,BLANK,YELLOW,10x4mm Item Location P/N Description 790841320600R PCBA,I/F BOARD,MI,LE1957-610 ROHS 10 C111,C144, 420431000260R CAP EC 10uF 25V M,105℃ ST 5x11 RoHS 20 C101,C102, 420431010461R CAP EC 100uF 16V M,105℃ ST 5x11(SK) RoH 30 C130,C133,C142,C145,C105, 420432200460R CAP EC 22uF 16V M,105℃ ST, 5x11,RoHS 40 C108, 420432210460R CAP EC 220uF 16V M,105℃ ST 6.3x11 RoHS 50 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 60 CN105, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 70 X101, 432008010370R XTAL 14.31818MHz 16pF HC-49US 30PPM,DIP, 80 CN103, 440819015030R CON,D-SUB,FEM.15P RA W/O SCREW DZ11AA1-H Item Location P/N Description 790841340600R PCBA,I/F BOARD,SMD,LE1957-610 ROHS 10 Q103,Q106, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 10 RA 410500045140R XSTR MMBT3904LT1G NPN 200MA 40V SOT23(ON 10 RA 410500045090R XSTR MMBT3904 NPN SOT-23(PANJIT)RoHS 20 Q102,Q105, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 20 RA 410500046180R XSTR MMBT3906LT1G PNP 200mA 40V SOT23(ON 20 RA 410500046090R XSTR MMBT3906 PNP SOT-23(PANJIT)RoHS 30 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 30 RA 410500075270R XSTR AO3415 P-CH,SOT23(AOS) RoHS 40 Q107, 410500050210R XSTR 2N7002,N-CH FET SOT-23 (PHILIPS)RoH 40 RA 410500050130R XSTR SN7002N N-CH SOT-23(INFINEON),RoHS 40 RA 410500050090R XSTR 2N7002 N-CH SOT-23(PANJIT)RoHS 50 TVS101,TVS102,TVS103,TVS104, 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 50 RA 411020026020R DIO BAV99-LF 350mW 70V SOT-23 (FEC)RoHS 50 RA 411020026390R DIO BAV99,SOT-23(INFINEON)RoHS 50 RA 411020026090R DIO BAV99 350mW 75V SOT-23(PEC RoHS 60 D103, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 31 60 RA 411020047020R DIO BAV70-LF, 70V SOT-23(FEC) ROHS 60 RA 411020047090R DIO BAV70, 70V SOT-23(PEC) ROHS 70 ZD101,ZD105,ZD106,ZD107,ZD108, 411100956920R ZENER 5.6V MMSZ5232A SOD123(PE C)RoHS 70 RA 411131556920R ZENER 5.6V 0.5W DDZ5V6B-F,SOD1 23(DIODES 70 RA 411131456920R ZENER 5.6V MMSZ5232A SOD-123(WILLAS)ROHS 80 U108, 412000279480R IC AT24C04N-10SU-2.7 SOP8 4K(A TMEL)RoHS 80 RA 412000279280R IC M24C04-WMN6TP4K SOP8 (ST) RoHS 80 RA 412000479990R IC CAT24C04WI-TE13 SOIC-8(CATALYST)RoHS 90 U102, 412000330830R IC AS1117L-1.8/TR-LF,SOT223(A1 SEMI)RoHS 90 RA 412000330020R IC LD1117AL-1.8V-A SOT223(UTC) RoHS 90 RA 412000330070R IC AZ1117H-1.8 SOT223(AAC)RoHS 100 U101, 412000372830R IC AS1117L-3.3TR-LF,SOT223(A1S EMI)RoHS 100 RA 412000372020R IC LD1117AL-3.3V-A SOT-223(UTC RoHS 100 RA 412000372070R IC AZ1117H-3.3 SOT-223(AAC)RoHS 110 U103, 412000435480R IC AT24C02BN-10SU-1.8 SOIC8 2K (ATMEL)Ro 110 RA 412000480990R IC CAT24C02WI-TE13 SOIC-8(CATALYST)RoHS 110 RA 412000480280R IC M24C02-RMN6TP SO8(ST)RoHS 120 U105, 412000508190R IC TSUM16AL-LF-1 PQFP100(MSTAR)RoHS 130 U106, 412000373190R IC SST25VF010A-33-4C-SAE,SOIC- 8(SST)RoH 130 RA 412000486310R IC PM25LV010A-100SCE SOIC8(PMC)RoHS 130 RA 412000486190R IC PS25LV010A-100SCE SOIC8(MSTAR)RoHS 140 R190,R170,R171,R103, 414916000050R RES SMD (0603) 0Ω J,RT RoHS 150 R186,R187, 414916010050R RES SMD (0603) 10Ω J,RT RoHS 160 R130,R129,R114,R117,R120, R125,R127,R131,R132,R101, R167,R168,R178,R179,R124, 414916010150R RES SMD (0603) 100Ω J,RT RoHS REV:A 170 R157,R158,R159,R160,R161, R162,R163, 414916010250R RES SMD (0603) 1KΩ J,RT RoHS REV:A 180 R106,R172,R180,R181,R191, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS 190 R102, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS 200 R105, 414916020350R RES SMD (0603) 20KΩ J,RT RoHS REV:A 210 R136,R137, 414916022250R RES SMD (0603) 2.2KΩ J,RT RoHS 220 R121, 414916047150R RES SMD (0603) 470Ω J,RT RoHS REV:A 230 R108,R110,R149,R150,R154, R155,R173,R174,R166,R182, R183,R184,R185,R109,R122, 414916047250R RES SMD (0603) 4.7KΩ J,RT RoHS 240 R169, 414916390010R RES SMD (0603) 390Ω F,RT RoHS 250 R133,R134,R135, 414916750910R RES SMD (0603) 75Ω F,RT RoHS REV:A 260 RP102, 415751035080R RP(0612)10KΩ x4 1/16W J 8P4R RoHS 270 C158,C159,C160,C161,C162, C163,C164, 419301010560R C SMD(0603) NPO 100PF/50V J RoHS 280 C153,C154, 419302200560R C SMD(0603) NPO 22PF/50V J RoHS 290 C126, 419302210560R C SMD(0603) NPO 220PF/50V J RoHS 300 C125, 419303300560R C SMD(0603) NPO 33PF/50V J RoHS 32 310 C103,C104,C106,C107,C109, C129,C156,C131,C132,C134, C135,C136,C137,C139,C141, C143,C147,C148,C149,C150, C151,C152,C166, 419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS 320 C140, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A 330 C112,C113,C114,C115,C116, C117,C118, 419314730060R C SMD (0603) X7R 0.047uF 50V,K RoHS 340 FB101, 432002312111R BEAD CORE SMD(0805)120Ω 300mA RoHS 350 FB102,FB103,FB105,FB106, 432002360012R BEAD CORE SMD(0805)60Ω 800mA GBK201209T 360 CN104, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z 370 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB 380 490831300100R PCB,I/F BOARD, LE1957-X10 390 R107, 414916022150R RES SMD (0603) 220Ω J,RT RoHS REV:A 400 R113,R116,R119, 414916560910R RES SMD (0603) 56Ω F,RT RoHS REV:A 410 FB107,FB108,FB109, 432002360140R BEAD CORE SMD(0603)60Ω 600mA, GBK160808 420 511130002203R SOLDER PASTE,Sn96.5/Ag3.0/Cu0.5(SAC305 O 420 RA 511130002200R SOLDER PASTE,Sn96.5-Ag3.0-Cu0.5 ROHS 420 RA 511130002201R SOLDER PASTE,Sn96.5%Ag3.0%Cu0.5% For CMO module ITEM Location P/N Description 790841300500R PCBA,I/F BOARD,LE1957-510 ROHS 10 629030009410R PROGRAM,LE1957-510 ROHS 20 790841320600R PCBA,I/F BOARD,MI,LE1957-610 ROHS 30 790841340600R PCBA,I/F BOARD,SMD,LE1957-610 ROHS 40 511130001201R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5(SAC305 VAC 40 RA 511130001200R SOLDER BAR,Sn96.5/Ag3.0/Cu0.5/Ni0.06/Ge0 50 506440003800R LABEL,BLANK,YELLOW,10x4mm ITEM Location P/N Description 790841320600R PCBA,I/F BOARD,MI,LE1957-610 ROHS 10 C111,C144, 420431000260R CAP EC 10uF 25V M,105℃ ST 5x11 RoHS 20 C101,C102, 420431010461R CAP EC 100uF 16V M,105℃ ST 5x11(SK) RoH 30 C130,C133,C142,C145,C105, 420432200460R CAP EC 22uF 16V M,105℃ ST, 5x11,RoHS 40 C108, 420432210460R CAP EC 220uF 16V M,105℃ ST 6.3x11 RoHS 50 CN101, 430631060020R WAFER 2.0mm 6P 180°,RoHS 60 CN105, 430631080130R WAFER 2x4P 2.0mm,200PHD-2*4ST RoHS 70 X101, 432008010370R XTAL 14.31818MHz 16pF HC-49US 30PPM,DIP, 80 CN103, 440819015030R CON,D-SUB,FEM.15P RA W/O SCREW DZ11AA1-H ITEM Location P/N Description 790841340600R PCBA,I/F BOARD,SMD,LE1957-610 ROHS 10 Q103,Q106, 410500045210R XSTR PMBT3904 NPN 200MA,40V SOT23(PHILIP 10 RA 410500045140R XSTR MMBT3904LT1G NPN 200MA 40V SOT23(ON 10 RA 410500045090R XSTR MMBT3904 NPN SOT-23(PANJIT)RoHS 20 Q102,Q105, 410500046210R XSTR PMBT3906 PNP 200MA,40V SOT23(PHILIP 20 RA 410500046180R XSTR MMBT3906LT1G PNP 200mA 40V SOT23(ON 20 RA 410500046090R XSTR MMBT3906 PNP SOT-23(PANJIT)RoHS 30 Q101, 410500068290R XSTR AP2305GN P-CH SOT23(APEC) RoHS 30 RA 410500075270R XSTR AO3415 P-CH,SOT23(AOS) RoHS 40 Q107, 410500050210R XSTR 2N7002,N-CH FET SOT-23 (PHILIPS)RoH 40 RA 410500050130R XSTR SN7002N N-CH SOT-23(INFINEON),RoHS 40 RA 410500050090R XSTR 2N7002 N-CH SOT-23(PANJIT)RoHS 50 TVS101,TVS102,TVS103,TVS104, 411020026210R DIO BAV99 350mW 70V SOT-23(PHI RoHS 50 RA 411020026020R DIO BAV99-LF 350mW 70V SOT-23 (FEC)RoHS 50 RA 411020026390R DIO BAV99,SOT-23(INFINEON)RoHS 50 RA 411020026090R DIO BAV99 350mW 75V SOT-23(PEC RoHS 60 D103, 411020047210R DIO BAV70 85V SOT23 (PHILIPS) RoHS 60 RA 411020047020R DIO BAV70-LF, 70V SOT-23(FEC) ROHS 60 RA 411020047090R DIO BAV70, 70V SOT-23(PEC) ROHS 33 70 ZD101,ZD105,ZD106,ZD107,ZD108, 411100956920R ZENER 5.6V MMSZ5232A SOD123(PE C)RoHS 70 RA 411131556920R ZENER 5.6V 0.5W DDZ5V6B-F,SOD1 23(DIODES 70 RA 411131456920R ZENER 5.6V MMSZ5232A SOD-123(WILLAS)ROHS 80 U108, 412000279480R IC AT24C04N-10SU-2.7 SOP8 4K(A TMEL)RoHS 80 RA 412000279280R IC M24C04-WMN6TP4K SOP8 (ST) RoHS 80 RA 412000479990R IC CAT24C04WI-TE13 SOIC-8(CATALYST)RoHS 90 U102, 412000330830R IC AS1117L-1.8/TR-LF,SOT223(A1 SEMI)RoHS 90 RA 412000330020R IC LD1117AL-1.8V-A SOT223(UTC) RoHS 90 RA 412000330070R IC AZ1117H-1.8 SOT223(AAC)RoHS 100 U101, 412000372830R IC AS1117L-3.3TR-LF,SOT223(A1S EMI)RoHS 100 RA 412000372020R IC LD1117AL-3.3V-A SOT-223(UTC RoHS 100 RA 412000372070R IC AZ1117H-3.3 SOT-223(AAC)RoHS 110 U103, 412000435480R IC AT24C02BN-10SU-1.8 SOIC8 2K (ATMEL)Ro 110 RA 412000480990R IC CAT24C02WI-TE13 SOIC-8(CATALYST)RoHS 110 RA 412000480280R IC M24C02-RMN6TP SO8(ST)RoHS 120 U105, 412000508190R IC TSUM16AL-LF-1 PQFP100(MSTAR)RoHS 130 U106, 412000373190R IC SST25VF010A-33-4C-SAE,SOIC- 8(SST)RoH 130 RA 412000486310R IC PM25LV010A-100SCE SOIC8(PMC)RoHS 130 RA 412000486190R IC PS25LV010A-100SCE SOIC8(MSTAR)RoHS 140 R190,R170,R171,R103, 414916000050R RES SMD (0603) 0Ω J,RT RoHS 150 R186,R187, 414916010050R RES SMD (0603) 10Ω J,RT RoHS 160 R130,R129,R114,R117,R120,R125,R127, R131,R132,R101,R167,R168,R178,R179, R124, 414916010150R RES SMD (0603) 100Ω J,RT RoHS REV:A 170 R157,R158,R159,R160,R161,R162,R163, 414916010250R RES SMD (0603) 1KΩ J,RT RoHS REV:A 180 R106,R172,R180,R181,R191, 414916010350R RES SMD (0603) 10KΩ J,RT RoHS 190 R102, 414916010450R RES SMD (0603) 100KΩ J,RT REV:A RoHS 200 R105, 414916020350R RES SMD (0603) 20KΩ J,RT RoHS REV:A 210 R136,R137, 414916022250R RES SMD (0603) 2.2KΩ J,RT RoHS 220 R121, 414916047150R RES SMD (0603) 470Ω J,RT RoHS REV:A 230 R108,R110,R149,R150,R154,R155,R173, R174,R166,R182,R183,R184,R185,R109, R122, 414916047250R RES SMD (0603) 4.7KΩ J,RT RoHS 240 R169, 414916390010R RES SMD (0603) 390Ω F,RT RoHS 250 R133,R134,R135, 414916750910R RES SMD (0603) 75Ω F,RT RoHS REV:A 260 RP102, 415751035080R RP(0612)10KΩ x4 1/16W J 8P4R RoHS 270 C158,C159,C160,C161,C162,C163,C164, 419301010560R C SMD(0603) NPO 100PF/50V J RoHS 280 C153,C154, 419302200560R C SMD(0603) NPO 22PF/50V J RoHS 290 C126, 419302210560R C SMD(0603) NPO 220PF/50V J RoHS 300 C125, 419303300560R C SMD(0603) NPO 33PF/50V J RoHS 310 C103,C104,C106,C107,C109,C129,C156, C131,C132,C134,C135,C136,C137,C139, C141,C143,C147,C148,C149,C150,C151, C152,C166, 419311040060R C SMD(0603) X7R 0.1uF/50V K RoHS 320 C140, 419311054070R C SMD(0805) X7R 1uF/16V K RoHS REV:A 330 C112,C113,C114,C115,C116,C117,C118, 419314730060R C SMD (0603) X7R 0.047uF 50V,K RoHS 340 FB101, 432002312111R BEAD CORE SMD(0805)120Ω 300mA RoHS 350 FB102,FB103,FB105,FB106, 432002360012R BEAD CORE SMD(0805)60Ω 800mA GBK201209T 360 CN104, 444099030030R CON, SMD 1.0mm 30PIN RoHS AL2309-A0G1Z 370 506140005700R LABEL,BARCODE,BLANK,33x7mm, ROHS,FOR PCB 380 490831300100R PCB,I/F BOARD, LE1957-X10 390 R107, 414916022150R RES SMD (0603) 220Ω J,RT RoHS REV:A 400 R113,R116,R119, 414916560910R RES SMD (0603) 56Ω F,RT RoHS REV:A 410 FB107,FB108,FB109, 432002360140R BEAD CORE SMD(0603)60Ω 600mA, GBK160808 420 511130002203R SOLDER PASTE,Sn96.5/Ag3.0/Cu0.5(SAC305 O 420 RA 511130002200R SOLDER PASTE,Sn96.5-Ag3.0-Cu0.5 ROHS 420 RA 511130002201R SOLDER PASTE,Sn96.5%Ag3.0%Cu0.5% 34 SCHEMATIC DIAGRAM 1. DC to DC 2. Input 35 3. Scaler_TSUM16AL 4. Key Pad 36 5. Inverter 6. Power 37 Nov. 2006 P/NO:MFL36713651 Printed in China