COLOR MONITOR SERVICE MANUAL Website:http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.html CAUTION BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS NO. : CL-66 MODEL: L1515S(K) (L1515SN-AL**B) ( ) **Same model for Service *Same looking with new chassis. Issue Date; 2004.9. *To apply the Genesis ZAN3SL Chip. 1 2 CONTENTS SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 BLOCK DIAGRAM .................................................. 8 DESCRIPTION OF BLOCK DIAGRAM.....................9 ADJUSTMENT ...................................................... 10 SERVICE OSD ...................................................... 11 TROUBLESHOOTING GUIDE .............................. 12 WIRING DIAGRAM ............................................... 16 EXPLODED VIEW...................................................17 REPLACEMENT PARTS LIST ...............................19 SCHEMATIC DIAGRAM......................................... 21 SPECIFICATIONS 1. LCD CHARACTERISTICS Type : TFT XGA LCD Module Size : 352.0(H) x 263.5(V) x 14.0(T) Pixel Pitch : 0.297mm x 0.297mm Color Depth : 6bits(with FRC)/ 16M colors Active Video Area : 15.0inch (304.128 x 228.096) Surface Treatment : Anti-Glare, Hard Coating (3H) Backlight Unit : Top/Bottom edge side 2CCFL Electrical Interface : LVDS interface 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio ≥ 10 Left : 55° min. 65° typ. Right: 55° min. 65° typ. Top : 45° min. 45° typ. Bottom: 50° min. 55° typ. 2-2. Luminance : 200(min.), 250(typ.) at Center point 2-3. Contrast Ratio :300(min.), 400(typ.) 3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal 1) Type : Separate Sync. (Horizontal & Vertical) 2) Input Voltage Level : Low=0~0.8V, High=2.1~5.5V 3) Sync Polarity : Positive or Negative 3-2. Video Input Signal 1) Type : R, G, B Analog 2) Voltage Level : 0~0.7 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.35 Vp-p c) Color 15, 0 : 0.7 Vp-p 3) Input Impedance : 75 Ω 3-3. Operating Frequency Horizontal : 30 ~ 63kHz Vertical : 56 ~ 75Hz 4. POWER SUPPLY 4-1. Power 100-240V~, 50/60Hz 0.6A 4-2. Power Consumption 5. ENVIRONMENT 5-1. Operating Temperature: 10°C~35°C (50°F~95°F) 5-2. Operating Humidity : 10%~80% 5-3. MTBF : 50,000 Hours (Min.) Lamp Life : 40,000 Hours (Min.) 6. DIMENSIONS (with TILT/SWIVEL) (FULL Up Position) Width : 350mm (13.78'') Depth : 133mm (5.24'') Height : 318mm (12.52'') (Folded Position) Width : 350mm (13.78'') Depth : 64mm (2.52'') Height : 334mm (13.15'') 7. WEIGHT (with TILT/SWIVEL) Net. Weight : 2.5kg (5.51 lbs) Gross Weight : 5.5kg (12.13 lbs) MODE POWER ON (NORMAL) STAND-BY SUSPEND DPM OFF POWER S/W OFF H/V SYNC ON/ON OFF/ON ON/OFF OFF - POWER CONSUMPTION less than 25 W less than 1 W less than 1 W less than 1 W less than 1 W LED COLOR GREEN AMBER AMBER AMBER OFF VIDEO ACTIVE OFF OFF OFF - 3 WARNING FOR THE SAFETY-RELATED COMPONENT. • There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard. • Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee. TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. • Must mount the module using mounting holes arranged in four corners. • Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. • Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. • Protect the module from the ESD as it may damage the electronic circuit (C-MOS). • Make certain that treatment person’s body are grounded through wrist band. • Do not leave the module in high temperature and in areas of high humidity for a long time. • The module not be exposed to the direct sunlight. • Avoid contact with water as it may a short circuit within the module. • If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.) WARNING BE CAREFUL ELECTRIC SHOCK ! • If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. • Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire. PRECAUTION CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation. 4 SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton- tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti- static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) 5 General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。F to 600。F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500。F to 600。F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. 6 Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. TIMING CHART 7 VIDEO SYNC C E D F A B H / V H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) H (Pixels) V (Lines) Sync Polarity + – – + – – – – – – – – + + + + + + + + – – – – – – + + Dot Clock 25.175 28.322 25.175 30.24 31.5 31.5 36.0 40.0 50.0 49.5 57.2832 65 75 78.75 Frequency 31.468 KHz 70.0 Hz 31.468 KHz 70.0 Hz 31.469 KHz 60.0 Hz 35.00 KHz 66.67 Hz 37.861 KHz 72.8 Hz 37.50 KHz 75.0 Hz 35.156KHz 56.25 Hz 37.879 KHz 60.3 Hz 48.077 KHz 72.188 Hz 46.875 KHz 75.0 Hz 49.725 KHz 74.55 Hz 48.363 KHz 60.0 Hz 56.476 KHz 70.0 Hz 60.023 KHz 75.0 Hz Resolution 640 x 350 720 x 400 640 x 480 640 x 480 640 x 480 640 x 480 800 x 600 800 x 600 800 x 600 800 x 600 832 x 624 1024 x 768 1024 x 768 1024 x 768 Total Period ( E ) 800 449 900 449 800 525 864 525 832 520 840 500 1024 625 1056 628 1040 666 1056 625 1152 667 1344 806 1328 806 1312 800 Video Active Time ( A ) 640 350 720 400 640 480 640 480 640 480 640 480 800 600 800 600 800 600 800 600 832 624 1024 768 1024 768 1024 768 Blanking Time ( B ) 160 99 180 49 160 45 224 45 192 40 200 20 224 25 256 28 240 66 256 25 320 43 320 38 304 38 288 32 Sync Duration ( D ) 96 2 108 2 96 2 64 3 40 3 64 3 72 2 128 4 120 6 80 3 64 3 136 6 136 6 96 3 Back Porch ( F ) 48 60 55 34 48 33 96 39 128 28 120 16 128 22 88 23 64 23 160 21 224 39 160 29 144 29 176 28 Front Porch ( C ) 16 37 17 13 16 10 64 3 24 9 16 1 24 1 40 1 56 37 16 1 32 1 24 3 24 3 16 1 MODE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 (MAC) (TEXT) 8 BLOCK DIAGRAM LIPS 5V 5V Power + + Inverter BRT-CTL INV-CTL gmZAN3SL ADC Scaling PLL OSD LVDS Transmitter Panel MCU EEPROM (System) LVDS Analog(R/G/B) D-Sub To Key Control 3.3V VMOD 3.3 V 1.8 V Regulator 3.3 V 1.8 V Switch (System) 3.3V MOD-ON 5V DESCRIPTION OF BLOCK DIAGRAM 9 1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 80MHz. This part consists of the Scaler, ADC and TMDS receiver . The Scaler gets the video signal converted analog to digital, interpolates input to 1024 X768 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the one 5V, one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board. 3.3V is provided for LCD panel and inverter, 5V is provided for micom. Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board. 3. MICOM Part. This part consists of EEPROM IC which stores control data, Reset IC and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM. 10 ADJUSTMENT Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy “UserPort.sys” file to “c:\WINNT\system32\drivers” folder b) Run Userport.exe c) Remove all default number d) Add 300-3FF e) Click Start button. f) Click Exit button. 2. EDID Read & Write 1) Run WinEDID.exe 2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button 11 Figure 1. Cable Connection 220 IBM Compatible PC Video Signal Generator PARALLEL PORT Power inlet (required) Power LED ST Switch Power Select Switch (110V/220V) Control Line Not used RS232C PARALLEL V-SYNC POWER ST VGS MONITOR E E V-Sync On/Off Switch (Switch must be ON.) F F A A B B C C 15 10 5 5 6 9 1 1 1 14 13 25 6 5V 5V 5V 4.7K 4.7K 4.7K 74LS06 74LS06 OFF ON OFF ON 11 SERVICE OSD 1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) PANEL : To select applied module. 12 TROUBLESHOOTING GUIDE 1. NO POWER CHECK U801. CHECK U801 PIN 1& U803 PIN 3 VOLTAGE (5V) ? NO NO POWER (POWER INDICATOR OFF) CHECK POWER BOARD, AND FIND OUT A SHORT POINT AS OPENING EACH POWER LINE CHECK J707 VOLTAGE PIN5, PIN6 (5V)? NO CHECK 5VR LINE (OPEN CHECK) CHECK Q803 PIN 3(3.3V) & U803 PIN 4 (1.8V)? NO CHECK IIC LINE CONNECTION (U501, U502) CHECK U201 VCC, XTAL, RESET IS U201 PIN88 VOLTAGE REPEATED AS PULSE SHAPE ? NO YES YES YES NO PROBLEM YES CHECK KEY CONTROL CONNECTOR ROUTINE 1 1 1 2 1 2 Waveforms J707-#5, 6 / U801-#1/U803-#3 U201-#88 13 2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS CHECK MICOM INV ON/OFF PORT. (U501 PIN9) J707 PIN2 2.5V? NO NO RASTER (OSD IS NOT DISPLAYED) CHECK LIPS J707 PIN5, PIN 6 5V? NO 1. CONFIRM BRIGHTNESS OSD CONTRL STATE. 2. CHECK MICOM DIM-ADJ PORT(U501 PIN41) J707 PIN1 5V? NO LIPS CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE? NO REPLACE CCFL LAMP IN THE LCD MODULE YES YES YES YES 3 4 Waveforms J707-#2 J707-#2 1 3 4 Inverter Off Micom Port check J705 Inverter output Inverter On Micom Port check J705 Inverter output 1 J707-#5, 6 / U801-#1/U803-#3 14 1. CHECK PIN88 SOLDERING CONDITION 2. CHECK X501 3. TROUBLE IN U201 U201 POWER PINS 3.3V? NO CHECK U803, U801 U201 PIN88 OSCILLATE AS 12MHZ? CHECK CONNECTION LINE FROM U201 TO U501 TROUBLE IN CABLE OR LCD MODULE CHECK 5VR LINE U501 PIN8 5V? YES YES YES YES 3. NO RASTER (OSD IS NOT DISPLAYED) – gmZAN3SL NO RASTER (OSD IS NOT DISPLAYED) U501 PIN43 IS 48KHz H-SYNC? PIN44 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? NO NO NO 2 2 6 Waveforms U201-#88 6 U501-#43, 44 15 CHECK U803, U801 U201 POWER PIN99(1.8V) PIN33(3.3V) ? NO 1. CHECK PC 2. CHECK SIGNAL CABLE & D-SUB CONNECTOR LINE CHECK R,G,B INPUT? U201 PIN 70,74,77 NO CHECK H-SYNC LINE (D-SUB→U501 →U201 PIN95) CHECK H-SYNC INPUT U201 PIN 95? NO YES YES YES CHECK V-SYNC LINE (D-SUB→U501 →U201 PIN96) CHECK V-SYNC INPUT U201 PIN 96? NO YES NO RASTER (OSD IS DISPLAYED) 4. NO RASTER (OSD IS DISPLAYED) – gmZAN3SL TROUBLE IN LCD MODULE YES 16 J706 J704 CN1 CN2 J707 J8 J1 WIRING DIAGRAM Connector Ass’y P/N: 6631T20024B Connector Ass’y P/N: 6631T11012R 17 EXPLODED VIEW 010 020 060 070 080 090 100 110 030 040 050 18 EXPLODED VIEW PARTS LIST 010 020 030 040 050 060 070 080 090 100 110 3091TKL068R CABINET ASSEMBLY, L1515SL BRAND .. BK PC+ABS, BK SPRAY" 6304FLP156A LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4NA LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC LPL NJ,250NITS 6304FLP146A LCD(LIQUID CRYSTAL DISPLAY), LM150X08-A4K8 LG PHILPS TFT COLOR PSWG,LVDS,16MS,SS S D-IC 3809TKL047H BACK COVER ASSEMBLY, L1515SL .. BK,PC+ABS" 3043TKK122Q TILT SWIVEL ASSEMBLY, L1515SL .. B/C:BK,PC+ABS" 6871TST393A PWB(PCB) ASSEMBLY,SUB, L1515SL CONTROL TOTAL BRAND CL-32 3313TL5109A MAIN TOTAL ASSEMBLY, L1515SN ZAN3SL PRN BRAND CL-66 6871TPT271X PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF 450V 6871TPT271N PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 15INCH POWER TOTAL LIEN CHANG C306 68PF 6631T11012R CONNECTOR ASSEMBLY, 20P H-H 140MM UL20276 PANEL LINK CABLE LM567D 4951TKS104R METAL ASSEMBLY, FRAME L1515SL LPL X08 4814TKK236A SHIELD, INVERTER WIRE SHIELD(TOP) 4814TKK237A SHIELD, INVERTER SHIELD CAP(BOTTOM) Description Part No. Ref. No. - 19 - DATE: 2004. 9. 10. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION C204 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C205 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C206 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C207 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C208 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C210 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C213 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C214 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C215 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C216 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C217 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C218 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C219 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C220 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C221 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C222 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C223 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C224 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C225 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C226 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C227 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C231 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C232 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C233 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C234 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C503 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C504 0CE106CK610 "10UF SHL,SD 50V 20% BULK F" C506 0CC030CK01A 3PF 1608 50V 0.25 PF R/TP C507 0CC180CK41A 18PF 1608 50V 5% R/TP NP0 C508 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C701 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C708 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C709 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C717 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C718 0CC101CK41A 100PF 1608 50V 5% R/TP NP0 C720 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C721 0CC680CK41A 68PF 1608 50V 5% R/TP NP0 C727 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C732 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C733 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7 C734 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7 C735 0CK104CK56A 0.1UF 1608 50V 10% R/TP X7 C801 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C819 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C820 0CE107EF610 "100UF KMG,RD 16V 20% FL BU" C821 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C829 0CK103CK51A 0.01UF 1608 50V 10% R/TP B C831 0CE107EF610 "100UF KMG,RD 16V 20% FL BU" C832 0CE107EF610 "100UF KMG,RD 16V 20% FL BU" C833 0CK105CD56A 1UF 1608 10V 10% R/TP X7R C834 0CC102CK41A 1000PF 1608 50V 5% R/TP NP DATE: 2004. 9. 10. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION D701 0DS226009AA KDS226 TP KEC SOT-23 80V D702 0DS226009AA KDS226 TP KEC SOT-23 80V D706 0DS226009AA KDS226 TP KEC SOT-23 80V ZD701 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W ZD702 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W ZD703 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W ZD704 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W ZD705 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W ZD711 0DZKE00138A KDZ5.6V KEC R/TP USC 0.2W U501 0IZZTSZ577A L1515SN ZAN3SL MICOM ASSY U502 0ISG240860B M24C08W6 SGS-THOMSON 8SOP U801 0IPMGKE011A KIA78D33F KEC DPAK R/TP 3. U803 0IPMGSG019A LD1117S18TR STM SOT223 R/T Q502 0IKE704200H KIA7042AP TO-92 TP 4.2 VO U802 0TFVI80023A VISHAY SI3865DV R/TP TSOP- Q503 0TR390409AE FAIRCHILD KST3904(LGEMTF) Q504 0TR390409AE FAIRCHILD KST3904(LGEMTF) Q505 0TR390409AE FAIRCHILD KST3904(LGEMTF) Q703 0TR390609FA KST3906-MTF TP SAMSUNG SO Q704 0TR390609FA KST3906-MTF TP SAMSUNG SO R201 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R202 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R203 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R208 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/T R209 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/T R210 0RJ1200D677 120 OHM 1/10 W 5% 1608 R/T R211 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R213 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R214 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R220 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R221 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R222 0RJ1004D677 1000000 OHM 1/10 W 5% 1608 R506 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R508 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R514 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R515 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R516 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R518 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R520 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R521 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R522 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R523 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R534 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R535 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/ R537 0RJ3301D677 3.3K OHM 1/10 W 5% 1608 R/ REPLACEMENT PARTS LIST CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS, READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL. * NOTE : S SAFETY Mark AL ALTERNATIVE PARTS MAIN BOARD CAPACITORS ICs DIODEs TRANSISTOR RESISTORs DATE: 2004. 9. 10. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION R541 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R542 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R543 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R544 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R545 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/T R547 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/T R548 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R549 0RJ0332D677 33 OHM 1/10 W 5% 1608 R/TP R555 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R557 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R560 0RJ4702D677 47000 OHM 1/10 W 5% 1608 R R561 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R566 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/T R701 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R703 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R706 0RJ0752D677 75 OHM 1/10 W 5% 1608 R/TP R708 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/T R709 0RJ1001D677 1K OHM 1/10 W 5% 1608 R/TP R716 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R717 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R721 0RJ4700D677 470 OHM 1/10 W 5% 1608 R/T R722 0RJ1000D677 100 OHM 1/10 W 5% 1608 R/T R723 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R724 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R726 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/T R727 0RJ1002D677 10K OHM 1/10 W 5% 1608 R/T R728 0RJ1502D677 15K OHM 1/10 W 5% 1608 R/T R735 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R737 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R744 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R747 0RJ4701D677 4.7K OHM 1/10 W 5% 1608 R/ R749 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R770 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R771 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R775 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R779 0RJ0682D677 68 OHM 1/10 W 5% 1608 R/TP R780 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R781 0RJ2001D677 2K OHM 1/10 W 5% 1608 R/TP R782 0RJ0471D677 4.7 OHM 1/10 W 5% 1608 R/T R803 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP R811 0RJ2202D677 22K OHM 1/10 W 5% 1608 R/T R812 0RJ5600D677 560 OHM 1/10 W 5% 1608 R/T R813 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R814 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R815 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R816 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R817 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R818 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R819 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R820 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R821 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R822 0RJ0472D677 47 OHM 1/10 W 5% 1608 R/TP R827 0RJ0000D677 0 OHM 1/10 W 5% 1608 R/TP U201 0IPRPGN016A "GMZAN3SL-BD GENESIS 128P,P" X501 6212AA2004A HC-49U TXC 12.0MHZ +/- 30 LED1 0DLLT0089AA LITEON LTL-1BEDJ-0C2 TP GR R1 0RD4701Q609 4.70K 1/4W(3 5% TA52 DATE: 2004. 9. 10. *S *AL LOC. NO. PART NO. DESCRIPTION / SPECIFICATION R2 0RD4701Q609 4.70K 1/4W(3 5% TA52 R3 0RD1501Q609 1.50K 1/4W(3 5% TA52 R4 0RD1501Q609 1.50K 1/4W(3 5% TA52 R5 0RD3301Q609 3.30K 1/4W(3 5% TA52 R6 0RD3301Q609 3.30K 1/4W(3 5% TA52 R7 0RD9101Q609 9.10K 1/4W(3 5% TA52 SW1 140-058E SKHV10910B LGEC NON 12V 20 SW2 140-058E SKHV10910B LGEC NON 12V 20 SW3 140-058E SKHV10910B LGEC NON 12V 20 SW4 140-058E SKHV10910B LGEC NON 12V 20 SW5 140-058E SKHV10910B LGEC NON 12V 20 SW6 140-058E SKHV10910B LGEC NON 12V 20 SW7 140-058E SKHV10910B LGEC NON 12V 20 ZD1 0DZ560009AG GDZJ5.6B TP GRANDE DO-34 5 ZD2 0DZ560009AG GDZJ5.6B TP GRANDE DO-34 5 - 20 - OTHERs CONTROL BOARD SCHEMATIC DIAGRAM - 21 - 1. SCALER L1515/L1715 ZAN3SL # 1 2 5 U201-#88 5 2 - 22 - 2. MICOM L1515/L1715 MICOM # 2 1.5K(17") 6 U501-#43, 44 6 - 23 - 3. POWER L1515/L1715 POWER # 3 390 390 390 390 1 J707-#5,6/U801-#1/U803-#3 1 1 - 24 - 4. CONNECTOR & JACKS L1515/L1715 CONNECTOR & JACKS # 4 15K 4 J707-#2 3 J707-#2 1 J707-#5,6/U801-#1/U803-#3 1 4 3 Inverter Off Micom Port check J705 Inverter output Inverter On Micom Port check J705 Inverter output Blank Page1 Blank Page2 Sep. 2004 P/NO : 3828TSL097T Printed in Korea