COLOR MONITOR SERVICE MANUAL Website:http://biz.LGservice.com E-mail:http://www.LGEservice.com/techsup.html CAUTION BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS NO. : LM62A MODEL: L1970HR (L1970HR-BFR.A**RQP) ( ) **Same model for Service - 2 - CONTENTS 1. LCD CHARACTERISTICS Type : TFT Color LCD Module Active Display Area : 19 inch Pixel Pitch : 0.294 (H) x 0.294 (V) Color Depth : 16.2M colors Size : 396.0 (H) x 324.0 (V) x 17.5(D) Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Anti-Glare Operating Mode : Normally White, Transmissive mode Backlight Unit : 4-CCFL 2. OPTICAL CHARACTERISTICS 2-1. Viewing Angle by Contrast Ratio ≥ 10 Left : -70° min., -80°(Typ) Right : +70° min., +80°(Typ) Top :+60° min., +75°(Typ) Bottom : -70° min., -85°(Typ) 2-2. Luminance : 200(min), 250(Typ)-6500K : 150(min), 200(Typ)-9300K 2-3. Contrast Ratio : 450(min), 700(Typ), 1600(DCR) 3. SIGNAL (Refer to the Timing Chart) 3-1. Sync Signal • Type : Separate Sync, Digital, SOG, Composite sync 3-2. Video Input Signal 1) Type : R, G, B Analog 2) Voltage Level : 0~0.71 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.467Vp-p c) Color 15, 0 : 0.714Vp-p 3) Input Impedance : 75Ω 3-3. Operating Frequency Horizontal(Analog) : 30 ~ 83kHz Horizontal(Digital) : 30 ~ 71kHz Vertical : 56 ~ 75Hz 4. Max. Resolution D-sub Analog : 1280 x 1024@75Hz Digital : 1280 x 1024@60Hz 5. POWER SUPPLY 5-1. Power : AC 100~240V, 50/60Hz, 0.6A 5-2. Power Consumption 6. ENVIRONMENT 6-1. Operating Temperature : 10°C~35°C (50°F~95°F) (Ambient) 6-2. Relative Humidity : 10%~80% (Non-condensing) 6-3. MTBF : 50,000 HRS with 90% Confidence Lamp Life : 50,000 Hours(Min) 7. DIMENSIONS (with TILT/SWIVEL) Width : 411.3 mm (16.19'') Depth : 345 mm (13.58'') Height : 59 mm (2.32'') 8. WEIGHT (with TILT/SWIVEL) Net. Weight : 5.4 kg (11.91 lbs) Gross Weight : 7.45 kg (16.43 lbs) SPECIFICATIONS SPECIFICATIONS ................................................... 2 PRECAUTIONS ....................................................... 3 TIMING CHART ....................................................... 7 DISASSEMBLY ........................................................ 8 BLOCK DIAGRAM.....................................................9 DISCRIPTION OF BLOCK DIAGRAM .................. 10 ADJUSTMENT ...................................................... 12 SERVICE OSD ........................................................13 TROUBLESHOOTING GUIDE .............................. 14 WIRING DIAGRAM ............................................... 18 EXPLODED VIEW...................................................19 REPLACEMENT PARTS LIST ...............................21 SCHEMATIC DIAGRAM......................................... 23 MODE POWER ON (NORMAL) STAND-BY SUSPEND DPMS OFF POWER S/W OFF H/V SYNC ON/ON OFF/ON ON/OFF OFF/OFF - POWER CONSUMPTION less than 39 W less than 1 W less than 1 W less than 1 W less than 1 W LED COLOR BLUE AMBER AMBER AMBER OFF VIDEO ACTIVE OFF OFF OFF - - 3 - PRECAUTION WARNING FOR THE SAFETY-RELATED COMPONENT. • There are some special components used in LCD monitor that are important for safety. These parts are marked on the schematic diagram and the replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard. • Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee. TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT. • Must mount the module using mounting holes arranged in four corners. • Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. • Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel. • Protect the module from the ESD as it may damage the electronic circuit (C-MOS). • Make certain that treatment person’s body are grounded through wrist band. • Do not leave the module in high temperature and in areas of high humidity for a long time. • The module not be exposed to the direct sunlight. • Avoid contact with water as it may a short circuit within the module. • If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.) WARNING BE CAREFUL ELECTRIC SHOCK ! • If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms. • Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire. Leakage Current Hot Check Circuit CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation. 1.5 Kohm/10W To Instrument’s exposed METALLIC PARTS Good Earth Ground such as WATER PIPE, CONDUIT etc. AC Volt-meter - 4 - SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. d. Discharging the picture tube anode. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage. 4. Do not spray chemicals on or near this receiver or any of its assemblies. 5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton- tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 9. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti- static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) - 5 - General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500。F to 600。F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuitboard printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500。F to 600。F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. - 6 - Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. - 7 - TIMING CHART VIDEO SYNC B C E A D MODE H / V Sync Polarity Dot Clock Frequency Total Period ( E ) Video Active Time ( A ) Sync Duration ( D ) Front Porch ( C ) Blanking Time ( B ) Resolution 1 H(Pixels) + 25.175 31.469 800 640 16 96 48 640 x 350 V(Lines) - 70.09 449 350 37 2 60 2 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400 V(Lines) + 70.08 449 400 12 2 35 3 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480 V(Lines) - 59.94 525 480 10 2 33 4 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480 V(Lines) - 75 500 480 1 3 16 5 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600 V(Lines) + 60.317 628 600 1 4 23 6 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600 V(Lines) + 75.0 625 600 1 3 21 7 H(Pixels) +/- 57.283 49.725 1152 832 32 64 224 832 x 624 V(Lines) +/- 74.55 667 624 1 3 39 8 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768 V(Lines) - 60.0 806 768 3 6 29 9 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768 V(Lines) - 75.029 800 768 1 3 28 10 H(Pixels) +/- 100.0 68.681 1456 1152 32 128 144 1152 x 870 V(Lines) +/- 75.062 915 870 3 3 39 11 H(Pixels) +/- 92.978 61.805 1504 1152 18 134 200 1152 x 900 V(Lines) +/- 65.96 937 900 2 4 31 12 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024 V(Lines) + 60.02 1066 1024 1 3 38 13 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x 1024 V(Lines) + 75.035 1066 1024 1 3 38 - 8 - DISASSEMBLY Disassembly Hinge Cover. Remove the screws. # 1 Remove the screws. 1.Disassemble Control PCB. 2. Put the front face down. 1. Pull the front cover upward. 2. Then, let the all latches are separated. # 2 # 3 # 4 # 5 # 6 Disassemble back cover Pull out the cable. # 7 - 9 - BLOCK DIAGRAM D-SUB TSUMO56WHJ including (ADC/LVDS/SCALER /INPUT SWITCHING /TMDS/MICOM/ODC ) M25P10 (flash memory) LCD Module LVDS (Low Voltage Differential Signaling) 5V 1.8V Reg. LD1117S18 DVI-D R,G,B, H/V Sync Digital Signal 1.8V 3.3V 1.8V 3.3V 3.3V Reg. 78D33 5V 3.3V MP1583DN 12V 5V Power Inverter Adapter 12V Inverter Control 3.3V - 10 - DESCRIPTION OF BLOCK DIAGRAM 1. Video Controller Part. This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock. The pixel clock for each mode is generated by the PLL. The range of the pixel clock is from 25MHz to 135MHz. This part consists of the Scaler, ADC and TMDS receiver . The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter. 2. Power Part. This part consists of the 3.3V regulator to convert power which is provided 12V, 5V in Power board and Micom. 5V is provided for LCD panel. Also, 5V is converted 3.3V by regulator and 3.3V is converted 1.8V by regulator. Converted power is provided for IC in the main board. 3. MICOM Part. This part consists of EEPROM IC which stores control data and the Micom. The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable. The controlled data of each modes is stored in EEPROM. - 11 - LIPS Board Block Diagram EMI COMPONENTS LINE 100 ~ 240V INPUT RECTIFIER AND FILTER SWITCHING TRANSFORMER OUTPUT RECTIFIER AND FILTER 12V GND SIGNAL COLLENT- ION PHOTO- COUPLER ISOLATION PWM CONTROL CIRCUIT HVDC 100KHz PRIMARY SECONDARY 50 ~ 60Hz INVERTER CIRCUIT High Voltage 12V Operation description_LIPS 1. EMI components. This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse. 2. Input rectifier and filter. This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor. 3. Energy Transfer. This part function is for transfer the primary energy to secondary through a power transformer. 4. Output rectifier and filter. This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and also the over power protection is also monitor by this part. 5. Photo-Coupler isolation. This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage. 6. Signal collection. This part function is to collect the any change from the DC output and feed back to the primary through photo transistor. - 12 - ADJUSTMENT Windows EDID V1.0 User Manual Operating System: MS Windows 98, 2000, XP Port Setup: Windows 98 => Don’t need setup Windows 2000, XP => Need to Port Setup. This program is available to LCD Monitor only. 1. Port Setup a) Copy “UserPort.sys” file to “c:\WINNT\system32\drivers” folder b) Run Userport.exe c) Remove all default number d) Add 300-3FF e) Click Start button. f) Click Exit button. 2. EDID Read & Write 1) Run WinEDID.exe 2) Edit Week of Manufacture, Year of Manufacture, Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button - 13 - 220 IBM Compatible PC Video Signal Generator PARALLEL PORT Power inlet (required) Power LED ST Switch Power Select Switch (110V/220V) Control Line Not used RS232C PARALLEL V-SYNC POWER ST VGS MONITOR E E V-Sync On/Off Switch (Switch must be ON.) F F A A B B C C 15 10 5 5 6 9 1 1 1 14 13 25 6 5V 5V 5V 4.7K 4.7K 4.7K 74LS06 74LS06 OFF ON OFF ON 11 Figure 1. Cable Connection SERVICE OSD 1) Turn off the power switch at the front side of the display. 2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval. 3) The SVC OSD menu contains additional menus that the User OSD menu as described below. a) Auto Color : W/B balance and Automatically sets the gain and offset value. b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time. d) AGING : Select Aging mode(on/off). e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually. f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually. g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module. - 14 - TROUBLESHOOTING GUIDE 1. NO POWER NO POWER (POWER INDICATOR OFF) NO CHECK ADAPTER AND TEST WITH ANOTHER ONE 1 Waveforms U101-#127 CHECK U101 AND U102 NO NO CHECK U503 AND AROUND CIRCUIT CHECK U501 NO CHECK U502 YES CHECK J406 VOLTAGE PIN 1 (12V)? CHECK U503 PIN 5 VOLTAGE (5V) ? IS U501 PIN3 (3.3V) VOLTAGE ? IS U502 PIN2 (1.8V) VOLTAGE ? NO CHECK X-TAL CHECK U101 PIN 127 PULSE 1 YES YES YES YES - 15 - 2. NO RASTER (OSD IS NOT DISPLAYED) – INVERTER NO RASTER (OSD IS NOT DISPLAYED) NO NO NO NO REPLACE CCFL LAMP IN THE LCD MODULE CHECK 12V LINE, AND FIND OUT A OPEN POINT AS OPENING EACH POWER LINE CHECK MICOM INV ON/OFF PORT. CHECK SCALER DIM- ADJ PORT REPLACE INVERTER AND RECHECK J403 PIN1, PIN2 12V? J403 PIN7 3.3V? J403 PIN6 AND PULSE CHECK PULSE AS CONTACTING SCOPE PROBE TO CAUTION LABEL. (CONTACT PROBE TO CAUTION LABEL. CAN YOU SEE PULSE AT YOUR SCOPE? YES YES YES YES - 16 - 3. NO RASTER (OSD IS NOT DISPLAYED) – MSTAR NO RASTER (OSD IS NOT DISPLAYED) NO NO NO TROUBLE IN CABLE OR LCD MODULE CHECK U501 1. CHECK C110, C109 SOLDERING CONDITION 2. CHECK X101 3. TROUBLE IN U101 CHECK CONNECTION LINE FROM D-SUB TO U101 U101 PIN127, 128 OSCILLATE AS 14.31MHZ? U101 PIN32 IS 48KHz H-SYNC? PIN33 IS 60Hz V-SYNC? IS PULSE APPEARED AT SIGNAL PINS? AT MODE 12? 1 2 1 2 Waveforms U101-#127, 128 U101-#32 H-SYNC 2 U101-#33 V-SYNC YES YES YES U101 PIN 71, 87 3.3V? - 17 - 4. TROUBLE IN DPM TROUBLE IN DPM NO NO TROUBLE IN U101 CHECK PC PC IS NOT GOING INTO DPM OFF MODE CHECK H/V SYNC LINE CHECK R458, R459 CHECK U101 PIN 32,33 SYNC PULSE ? 3 3 Waveforms R458 H-Sync 3 R459 V-Sync YES YES - 18 - WIRING DIAGRAM 6631T12006F 6631T12006L 6631900080A 30P 7P 6P - 19 - EXPLODED VIEW 010 020 060 070 080 090 100 030 110 050 040 SCHEMATIC DIAGRAM - 23 - 1. SCALER - 24 - 2. POWER & WAFER - 25 - 3. DC-DC BLOCK Jun. 2006 P/NO : 38289S0041 Printed in Korea